SoC Thermal Engineer

About Qualcomm India Private Limited

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
• OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
• OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.

Job Title: SoC Thermal Engineer (Sr. Lead)

• Develop SoC Thermal analysis methodologies encompassing SoC, package, and systems for various Qualcomm products used in smartphones, laptops, automotive, and virtual reality headsets.
• Create strategies to predict and enhance thermally constrained scores (AnTuTu/Geekbench) and measure/tune them on post-Si platforms, including infrared imaging.
• Responsible for improving thermal mitigation strategies through power and thermal management to achieve optimal system thermal performance by means of thermal measurement.

Skills Required

• Strong analytical skills and mathematical modeling abilities.
• Perform SoC-level thermal analysis throughout the product development cycle to identify and mitigate thermal risks, including post-silicon validation and customer collaboration.
• Analyze SoC-level thermal performance to support architecture, product specifications, and Power-Performance-Area-Thermal optimization. Recommend thermal mitigation strategies.
• Develop advanced thermal methodologies, software tools, and scalable processes, collaborating with cross-functional teams to drive efficiency and achieve goals.
• Must have knowledge of SOC stack-up.
• Proficiency in scripting with PERL/Python; exposure to Machine Learning algorithms/frameworks is a plus.
• Thorough understanding of heat transfer mechanisms and CFD.
• Proficiency with state-of-the-art thermal analysis tools like Ansys Icepak/Flotherm.
• Experience with Thermal Measurement is preferred.

Equal Opportunity Employer

Qualcomm is an equal opportunity employer committed to providing an accessible hiring process for individuals with disabilities. Reasonable accommodations will be provided upon request to support participation in the hiring process and to ensure accessibility in the workplace. For accommodations, please contact [HIDDEN TEXT] or call Qualcomm's toll-free number. Please note that this email is for accommodation requests only and will not be used for application updates or inquiries.

Employees are expected to adhere to all applicable policies and procedures, including those regarding the protection of confidential information, as permissible by law.

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For more information about this role, please contact Qualcomm Careers.