Embedded Software Technical Lead

About Kandou AI - Redefining AI Infrastructure Economics

We are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our Technology:

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

The Role: Embedded Software Technical Lead

Location: Hyderabad, India
Type: Full-time (Hybrid/On-site implied by role nature)

Candidates are required to have 10+ years of experience in embedded software design and leadership within the semiconductor industry.

Your Mission

You will lead the implementation and delivery of assigned firmware modules and workstreams for Kandou's new ASIC products, under the technical direction of the overall Firmware Lead. You will remain hands-on in coding, debugging and bring-up, while mentoring engineers working on your scope.

Key Responsibilities

• Technical Leadership: Lead design, development, test and maintenance of real-time firmware modules for high-speed heterogeneous SoC platforms.
• Coding & Debugging: Remain hands-on in C/C++ development, RTOS integration (Zephyr/FreeRTOS), low-level drivers, bootloaders, secure boot and reliable firmware updates.
• Bring-up & Integration: Drive bring-up, hardware/software integration and root-cause analysis for assigned firmware, working with silicon design and validation teams.
• Mentorship: Mentor engineers on assigned work, guide implementation decisions and share knowledge; align broader technical decisions with the Firmware Lead.